| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method for a wafer capable of preventing the quality of processing on the wafer from becoming worse without sticking any sticking matter on the wafer while preventing the cutting capability of a cutting blade from deteriorating. SOLUTION: The processing method for the wafer includes a filler-containing protective tape sticking step of sticking a filler-containing protective tape 8 on a top surface of the wafer 2, a wafer supporting step of supporting the reverse surface of the wafer by a wafer supporting means, a wafer holding step of sucking and holding the wafer supported by the wafer supporting means by a chuck table 18, a dividing step of dividing the wafer sucked and held by the chuck table along a cutting schedule line together with the filler-containing protective tape into individual chips, and a removing step of removing the filler-containing protective tape from the top surface of the wafer after the dividing step. COPYRIGHT: (C)2010,JPO&INPIT |
