发明名称 EPOXY RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent adhesiveness and giving a cured material having low dielectric constant. Ž<P>SOLUTION: The epoxy resin composition contains 100 pts.mass of an epoxy resin containing 50-90 wt.% of an epoxy resin 1 expressed by formula (1) (n is 1-10) and 10-50 wt.% of an epoxy resin 2 expressed by formula (2), and 20-200 pts.mass of a modified cyclic olefin polymer having an epoxy group and/or an acid anhydride group. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010126645(A) 申请公布日期 2010.06.10
申请号 JP20080302900 申请日期 2008.11.27
申请人 YOKOHAMA RUBBER CO LTD:THE 发明人 SATO NAO;ISHIKAWA KAZUNORI
分类号 C08G59/38;C08G59/24;C08G59/62;C08L51/04;C08L63/00 主分类号 C08G59/38
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