发明名称 |
EPOXY RESIN COMPOSITION |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent adhesiveness and giving a cured material having low dielectric constant. Ž<P>SOLUTION: The epoxy resin composition contains 100 pts.mass of an epoxy resin containing 50-90 wt.% of an epoxy resin 1 expressed by formula (1) (n is 1-10) and 10-50 wt.% of an epoxy resin 2 expressed by formula (2), and 20-200 pts.mass of a modified cyclic olefin polymer having an epoxy group and/or an acid anhydride group. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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申请公布号 |
JP2010126645(A) |
申请公布日期 |
2010.06.10 |
申请号 |
JP20080302900 |
申请日期 |
2008.11.27 |
申请人 |
YOKOHAMA RUBBER CO LTD:THE |
发明人 |
SATO NAO;ISHIKAWA KAZUNORI |
分类号 |
C08G59/38;C08G59/24;C08G59/62;C08L51/04;C08L63/00 |
主分类号 |
C08G59/38 |
代理机构 |
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