| 摘要 |
<P>PROBLEM TO BE SOLVED: To keep a polishing characteristic required for polishing a wafer further long even when a groove becomes shallow by the wear of a retainer ring. <P>SOLUTION: This retainer ring includes, on a wafer polishing surface side of a retainer ring, a groove for introducing slurry into a wafer polishing surface and discharging polishing sludge to the outside from the wafer polishing surface, and the groove has a width-increased part increased in width between an opening and a bottom part of the groove. <P>COPYRIGHT: (C)2010,JPO&INPIT |
