| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring substrate having, on one surface, a pad for external connection which is not an obstacle to microfabrication of wiring, can maintain connection reliability of a via, and hardly causes deterioration in performance of the wiring substrate. <P>SOLUTION: The wiring substrate has a predetermined number of wiring layers and insulating layers between the respective wiring layers, and also has pads for external connection having surface plating layer for connection with external circuits, each pad 1 for external connection on the one surface of the wiring substrate having its outer peripheral edge 1a set back from an outer peripheral edge 2a of the surface plating layer 2 to the center of the pad. <P>COPYRIGHT: (C)2010,JPO&INPIT |
