| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame which enables obtaining a reliable semiconductor device, by improving the adhesion between a terminal and sealing resin, and to provide a semiconductor device that uses the lead frame and an intermediate product thereof, and to provide a method for manufacturing them. <P>SOLUTION: In the lead frame for a semiconductor device 10, with a plurality of terminals 13 in which one side is sealed with resin, a part 16 of the terminal 13 to be sealed with resin is in the shape of a polygonal pillar of five or more angles, or in the shape of odd-form pillar which has one or more notches or trenches along a vertical direction around the part. The formation of the part 16 to be sealed with resin is performed by etching processing or press working, and the formation of an exposed part 18 in the lower half of the terminal 13 is performed by etching processing. <P>COPYRIGHT: (C)2010,JPO&INPIT |
