| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a semiconductor device for power that uses a semiconductor module for power sealed by a transfer mold resin and can improve productivity and reduce costs by miniaturization, and simplification of wiring. <P>SOLUTION: The semiconductor device for power includes: the semiconductor module for power including a cylindrical conductor joined nearly vertically to a wiring pattern and including an opening exposed to the surface of the transfer mold resin; and an insert case that has a ceiling section and a peripheral wall section, and then an external terminal penetrated fittedly through the ceiling section and having a connection section at the outer and inner face sides of the ceiling section. An inner face side connection section of the external terminal is inserted into the cylindrical conductor, and the semiconductor module for power is set to the insert case. <P>COPYRIGHT: (C)2010,JPO&INPIT |
