| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a power semiconductor module that reduces a circuit pattern area formed on a circuit board and is sealed by a transfer mold resin for achieving miniaturization. <P>SOLUTION: In the power semiconductor module, a wiring metal plate electrically connects between power semiconductor elements joined to a circuit pattern, and between the power semiconductor elements and the circuit pattern. Cylindrical main terminals are joined, substantially perpendicularly, to the wiring metal plate and the circuit pattern, respectively. A cylindrical control terminal is joined, substantially perpendicularly, to the power semiconductor elements. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
