发明名称 METHOD FOR MANUFACTURING PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a reliable package, which can restrain the occurrence of cracks frequently occurred at a sealing process by using a laser beam to the package sealed with frit. <P>SOLUTION: In the method for manufacturing a package having a sealed space between two substrates arranged to face each other, the method comprises: a frit arrangement step of arranging the frit between two substrates so as to form a pattern in which a ring-shaped one section is interrupted at a first end and a second end when viewed from a direction where two substrates overlap with each other; a laser emitting step of emitting a laser beam so as to trace the frit and joining two substrates by melting the frit; and a sealing step of forming the sealed space between two substrates by arranging a sealing member between the first end and the second end of the frit so as to form a closed space by putting together with the pattern of the frit. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010129348(A) 申请公布日期 2010.06.10
申请号 JP20080302307 申请日期 2008.11.27
申请人 KYOCERA CORP 发明人 KIYOHARA TOSHIFUMI;NAGATA MASARU
分类号 H05B33/04;H01L51/50;H01M14/00 主分类号 H05B33/04
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