发明名称 METHOD OF MANUFACTURING BASE MATERIAL WITH BENDABLE WIRING AND ELECTRONIC APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a base material with a bendable wiring, wherein disconnection of the wiring crossing a bending line is not easily caused even if the base material is bent along the bending line. <P>SOLUTION: The method of manufacturing the base material with a bendable wiring has a step of forming the base material having a plurality of continuously neighboring regions through the bending line by applying a bending tendency-forming treatment along the predetermined bending line of the base material, and a step of obtaining the base material with a bendable wiring by forming the bendable wiring composed of conductors and crossing the bending line. The method of manufacturing the electronic apparatus has a step of obtaining an electronic apparatus by mounting at least one electronic component so as to be electrically connected to the bendable wiring of the base material with a bendable wiring, after manufacturing the base material with a bendable wiring. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010129905(A) 申请公布日期 2010.06.10
申请号 JP20080305189 申请日期 2008.11.28
申请人 TOPPAN FORMS CO LTD 发明人 KAWAZOME MITSURU;ONO HIROKI
分类号 H05K1/02;G06K19/07;G06K19/077;H05K3/00 主分类号 H05K1/02
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