发明名称 INJECTION MOLD AND RESIN MOLDED COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an injection mold with a mechanism that a gas is injected into a molten resin filled therein, which has a mold structure in which the injected gas is inhibited from invading a resin feed pathway. SOLUTION: This injection mold 1, composed of a first mold member 1A and a second mold member 1B mating each other, includes a cavity 2 for resin molding formed on the mating faces of the first mold member 1A and the second mold member 1B, the resin feed pathway 3 for filling the molten resin into the cavity 2, and a gas feed pathway 5 for injecting gas into the molten resin filled in the cavity 2, wherein the resin feed pathway 3 and the gas feed pathway 5 are disposed distant from each other. In the cavity 2, a gas shielding section 20 for inhibiting the gas injected from the gas feed pathway 5 from invading the resin feed pathway 3 is formed at a position between the resin feed pathway 3 and the gas feed pathway 5. The gas shielding section 20 is configured by a protrusion (bump) 21 formed on the inner surface of the cavity 2. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010125733(A) 申请公布日期 2010.06.10
申请号 JP20080303881 申请日期 2008.11.28
申请人 DIGITAL ELECTRONICS CORP 发明人 SUGITA KENJI;KUSAKABE NOBUHIRO;TOJO HIROMITSU
分类号 B29C45/26;B29C45/00 主分类号 B29C45/26
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