METHOD FOR MANUFACTURING CIRCUIT BOARD, AND CIRCUIT BOARD OBTAINED USING THE MANUFACTURING METHOD

摘要

A method for manufacturing a circuit board is provided with: a film forming step of forming a resin film on the surface of an insulating base material; a circuit pattern forming step of forming a circuit pattern section by forming a recessed section having a depth equivalent to the thickness of the resin film or more, with the outer surface of the resin film as a reference; a catalyst applying step of applying a plating catalyst or the precursor thereof on the surface of the circuit pattern section and on the surface of the resin film; a film removing step of removing the resin film from the insulating base material; and a plating step of forming an electroless plating film only on a portion where the plating catalyst or the precursor thereof remains after removing the resin film.