| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a glue for fixing a semiconductor element to a bottom of a recess of a package from flowing into a connection of a conductive wire. <P>SOLUTION: The semiconductor device includes: the semiconductor element 1; a package having a recess for storing the semiconductor element 1 therein and a pair of positive and negative lead electrodes; a conductive wire for connecting an electrode of the semiconductor element with the lead electrode exposed out of the bottom of the recess of the package; and a glue for fixing the semiconductor element to the bottom of the recess. The package includes a wall 6 projected from the bottom of the recess between a mount 4 where the semiconductor element is mounted and the connection 5 of the conductive wire of the lead electrode. The wall 6 has an end 6a extended from the bottom of the recess and connected to a sidewall of the recess. The height of the end 6a from the bottom of the recess is higher than the height of the wall 6 formed under the conductive wire 10. <P>COPYRIGHT: (C)2010,JPO&INPIT |
