| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for transfer and supply of a metal film capable of transferring a metal film in a stable amount without transferring an unnecessary metal film during the transference. <P>SOLUTION: The method is provided for evaporating the metal film on the surface of a transference substrate 101 in a directivity of a perpendicular direction to form a metal film on the bump 21 and a metal film in the recess 22 on the top of a bump 11 and on the bottom of a recess 12, respectively. The bump 11 has an inverse tapered shape, so that only by evaporating the metal film, the metal film on the bump 21 and the metal film in the recess 22 are formed in a discrete state; and pressing an electronic part 30 to the transference substrate 101 to which the metal film is adhered and heating the two bodies to transfer the metal film on the bump 21 of the transference substrate 101 to an electrode for connection 31 of the electronic part 30. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
