| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck having a structure in which plasma erosion against a silicone adhesive can be almost completely prevented and which allows smooth plasma treatment with no trouble to a work such as a wafer, and a method for manufacturing the same. SOLUTION: The electrostatic chuck 1 comprises a base 2, a ceramic plate 3, and an adhesive part 4. The adhesive part 4 is constituted of a silicone adhesive 41, an epoxy adhesive 42 and a polyimide film 43. Specifically, the silicone adhesive 41 is applied on a surface 20a of a pedestal 20, and the epoxy adhesive 42 and the polyimide film 43 are installed in a broad gap 40 constituted by a step part 20b of the pedestal 20 and the peripheral lower surface of the ceramic plate 3. Thereby, the adhesive part 4 has a structure in which the outer peripheral surface of the silicon adhesive 41 is covered with the epoxy adhesive 42, and the outer peripheral surface of the epoxy adhesive 42 is covered with the polyimide film 43. COPYRIGHT: (C)2010,JPO&INPIT |
