CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESIVE, AND MANUFACTURING METHOD OF CONDUCTIVE PARTICLE

摘要

PROBLEM TO BE SOLVED: To reduce connection resistance, and to provide stable connection superior in reliability, in a flip chip mounting using an anisotropic conductive material containing conductive particles. SOLUTION: The conductive particle has: a conductive core material; and a conductive layer to cover the core material, and on a surface of the core material, the conductive layer has a network structure constituting concavo and convex parts. COPYRIGHT: (C)2010,JPO&INPIT