| 摘要 |
PURPOSE: A complex lens is provided to obtain excellent heat resistance, to be applied to a solder reflow process, and to be suitably used as the lens of a camera module in which a semiconductor and the lens are integrated. CONSTITUTION: A complex lens(5) include a resin layer(4) adhering to a lens base(1). The lens base and the resin layer comprise a hardened resin. The lens base is marked as a chemical formula 1. The chemical formula 1 is (RSiO_1.5)_m(RSiO_0.5)_n. The lens base is obtained by hardening a silicon resin including polyorganosilsesquioxane of a box structure as a main component. In the chemical formula 1, R is a unsaturated group which is marked as -R^1-OCO-CR^2=CH2, -R^1-CR^2=CH2, or -CH=CH2, an alkyl group, a cycloalkyl group, a cycloalkenyl group, a phenyl group, an alkoxy group, or alkylsiloxy group. |
