PURPOSE: A method for manufacturing a printed circuit board is provided to miniaturize a product by increasing the density of wiring patterns. CONSTITUTION: A circuit pattern is formed on one side of a carrier(S110). One side of the carrier is compressed to one side of an insulator(S120). The carrier is removed(S130). One end of the circuit pattern is processed to form a hole which passes through the insulator(S140). A conductive material fills the inside the hole to corresponds to a via.
