发明名称 WIRING STRUCTURE BETWEEN STEPS AND WIRING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring structure between steps and a wiring method between steps which can stably form an insulating slope that should relax a steps portion of a wiring between steps by an inkjet method. <P>SOLUTION: A steps portion is covered by a first and a second slopes 15, 16 formed of a liquid drop of an insulating ink, and a first and a second metal wiring 18, 19 are respectively prepared on the slope top surfaces by a liquid drop of a conductive ink. At this time, a surface in which the first and the second slopes 15, 16 also including the steps portion are formed is covered with a liquid repellent layer 14 which liquid repels a dispersion medium of the insulating ink, two or more dots 20D by a liquid drop of a resin ink are formed inside a region in which these slopes 15, 16 are formed on the surface of this liquid repellent layer 14. In addition, each of the slopes 15, 16 is formed by a solid layer 21D formed from a liquid drop arranged in an aspect which connects dot rows consists of these dots 20D. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010129752(A) 申请公布日期 2010.06.10
申请号 JP20080302459 申请日期 2008.11.27
申请人 SEIKO EPSON CORP 发明人 UEHARA NOBORU
分类号 H01L21/60;H01L23/12;H01L25/065;H01L25/07;H01L25/18 主分类号 H01L21/60
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