| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a touch pad device for reducing the stress loaded to a film substrate. <P>SOLUTION: The touch pad device (24) includes: a cover member (30), having a touch surface (32) on an upper side; a printed circuit board (80), the top surface of which is covered with the cover member; a film substrate (40) including a detecting part (42), with a detection electrode (44) facing the touch surface installed thereon, a wiring part (52) extended from one end of the detecting part to electrically connect the detection electrode to the printed circuit board, and a shielding part (58), with a ground electrode (60) arranged under the detecting part to be electrically, connected to the printed circuit board installed thereon and arranged inside the cover film; and a holder (70), arranged between the film substrate and the printed circuit board, where the film substrate has a connection part (62 and 64) which bridges the shielding part and the wiring part, or bridges the shielding part and the detecting part, and is arranged in a space between the holder and the printed circuit board into a curved state. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
