| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent breakage of semiconductor elements at wire bonding in a semiconductor device in which a plurality of semiconductor elements are stacked. <P>SOLUTION: Inside the semiconductor device 10, the plurality of semiconductor elements (a first semiconductor element 12 and a second semiconductor element 14) are superposedly built. Specifically, the first semiconductor element 12 is fixed on the upper surface of comb-blade first island 16, and the second semiconductor element 14 is fixed on the lower surface of comb-blade second island 18. Comb-blade parts 16A and the like of the first island 16 and comb-blade parts 18A and the like of the second island 18 are alternately arranged when viewed from above. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
