| 摘要 |
PROBLEM TO BE SOLVED: To reduce chip size of a semiconductor memory by preventing useless data output buffers from being arranged. SOLUTION: The semiconductor memory includes a first pad, a second pad arranged adjacently to the first pad, a first output buffer connected to the first pad, and a second output buffer connected to the second pad. The first pad and the second pad are connected by metal. Consequently, read data is output to the first pad by using the first and second output buffers. Thus, driving performance of the first and second output buffers is made smaller as compared with the case when the read data are output to the first pad by using one output buffer. As a result, sizes of the first and second output buffers is made smaller as compared with the sizes of the conventional product, and the chip size of the semiconductor memory is reduced. COPYRIGHT: (C)2010,JPO&INPIT |
