| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and method for mounting electronic components, capable of preventing noise due to a repulsive force caused by driving of an imaging camera when positioning a substrate and a semiconductor chip. SOLUTION: The mounting apparatus includes: a mounting means 40 for mounting a semiconductor chip 4 on a substrate transferred by a transfer rail 2; a first supporting frame 52; a first driving means 57 provided on the first supporting frame and driving the mounting means in at least a vertical direction; an imaging camera 51 provided movably on the first supporting frame and entering between a semiconductor chip held by the mounting means and a substrate to position the substrate and the semiconductor chip before mounting the semiconductor chip to the substrate, and simultaneously picking up images of the semiconductor chip and the substrate; and a second driving means 58 having a linear motor 61 consisting of a mover 61a and a stator 61b, the mover being integrally provided with the imaging camera, the stator being provided on a second supporting frame 62 different from the first supporting frame, and driving the imaging means forward and backward by driving the mover. COPYRIGHT: (C)2010,JPO&INPIT |
