| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate dividing method for dividing the substrate so that a break end surface is perpendicular to the thickness direction and the width direction along a scribe line, and to provide a device for dividing the substrate. SOLUTION: In the substrate dividing method for dividing the substrate W having a TFT scribe line 13 formed on the surface thereof along the TFT scribe line 13, a part 52 of the substrate W to be divided is held by a surface holding member 23 and a set table 22 by such a light load as to come into contact with the set table, the center position in the width direction of the part 52 to be divided between the surface holding member 23 and the TFT scribe line 13 is pressurized to the set table 22 by a point fixing member 24 and, in this state, the part of the substrate protruded from the end of the set table 22 is mountain-folded and divided by a dividing member 25. COPYRIGHT: (C)2010,JPO&INPIT
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