| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board that effectivley minimizes the occurrence of solder bridge regardless of the packaging density. Ž<P>SOLUTION: A small diameter solder land group ha, out of solder lands constituting a solder land group hs, is arranged on the rear end side in the solder dip direction DIP of the printed circuit board 10, so that the spacing of solders is effectively widened in a region where the incidence of solder bridge is high on the rear end side in the solder dip direction DIP, and thereby the occurrence of solder bridge is minimized more effectively. Furthermore, since the clearance behind the solder land group hs is set wide continuously by the small diameter solder land group ha, and an extra clearance s1 is formed adjacently to the small diameter solder land group ha, the action of minimizing the occurrence of solder bridge can be imparted over a wider range behind the solder land group hs. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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