发明名称 PLASMA TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment device, which has a simple structure although only one treatment object surface of a treatment object can be treated, and is relatively reduced in size relative to the treatable size of treatment object, and hardly restricted by the thickness or material of the treatment object or the like. <P>SOLUTION: The processing device includes a pair of electrodes 31a and 32a; a power source 6 which supplies predetermined power to between the electrodes; a processing gas supply device 5 which supplies processing gas to between the electrodes; a duct 7 provided to cover the electrodes; and a cooling gas supply device 9 which supplies cooling gas 8 into the duct interior 71. The electrodes 31a and 32a heated with heat by discharge are cooled with the cooling gas 8, and cooling gas 8' warmed during the cooling is blown to at least the moving directional upstream side of a treatment object area 10b to be treated with processing gas turned into plasma in a treatment object surface 10a of the treatment object 10 for heating the treatment object 10. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010129197(A) 申请公布日期 2010.06.10
申请号 JP20080299508 申请日期 2008.11.25
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 YUGE MASAO;SHIBATA TETSUJI
分类号 H05H1/24;H05H1/46 主分类号 H05H1/24
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