| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket that can easily adapt to multiple pins in a semiconductor apparatus and also able to adapt to position shift between exterior shape of the semiconductor apparatus and terminals. SOLUTION: The IC socket 100 has a guide plate 1 and pogo pins 3 which are aligned in an alignment shape adapting to the terminal arrangement of the semiconductor apparatus 51. A plate body 13 of the guide plate 1 has a plurality of through-holes 11 provided in the alignment shape that adapts to the terminal arrangement of the pogo pins 3 and the semiconductor apparatus 51. Ball guides 17a which have diameters enlarged in tapered states on one surface are provided around the through-holes 11. Furthermore, pogo pin guides 17b which have diameters enlarged in tapered states are provided on the other surface. COPYRIGHT: (C)2010,JPO&INPIT |
