| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-treated metal material which has adequate solder wettability and an adequate bonding strength of a soldered portion imparted to the surface of a metal substrate having a passive state film on the outermost surface, without making a process complicated, without using a chemical solution or the like for pickling, of which the treatment for industrial waste becomes troublesome and without removing the passive state film by pickling, and to provide a method for manufacturing the same. SOLUTION: The surface-treated metal material has an adhesion layer 2 formed of a sputtered film which contains chromium (Cr) as a main component and has an internal residual stress that is a compressive stress or approximately zero, and a bonding layer 3 formed of a sputtered film which contains at least one type of copper (Cu), a mixed state of copper and nickel (Cu-Ni), a mixed state of copper and zinc (Cu-Zn), a mixed state of copper, nickel and zinc (Cu-Ni-Zn) as a main component, on the surface of the metal substrate 1 having the passive state film on the outermost surface layer, sequentially from the surface side of the metal substrate 1. COPYRIGHT: (C)2010,JPO&INPIT
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