| 摘要 |
The invention relates to a cooling arrangement with a first and at least one second heat-creating computer component, each coupled to at least one heatsink (40, 50). Heatsinks (40, 50) are arranged one after the other in a plane (10) in the direction of a provided coolant air stream (30). The cooling arrangement is distinguished in that heatsinks (40, 50) are of identical construction, and each heatsink (40, 50) comprises at least two side-by-side areas (41, 42, 51, 52) with heat transfer properties different from one another. In addition, heatsinks (40, 50) are arranged in plane (10) rotated relative to one another in such a manner that areas (42, 52) of heatsinks (40, 50) with a higher respective heat transfer power than the adjacent area (41, 51) are arranged one after the other in the direction of coolant air stream (30).
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