发明名称 EMI/RFI Shielding Resin Composite Material and Molded Product Made Using the Same
摘要 Disclosed is an electromagnetic wave EMI/RFI shielding resin composite material that includes a thermoplastic polymer resin, an electrically conductive filler having a polyhedral shape or being capable of forming a polyhedral shape, and a low-melting point metal, and a molded product made using the EMI/RFI shielding resin composite material.
申请公布号 US2010140534(A1) 申请公布日期 2010.06.10
申请号 US20090621580 申请日期 2009.11.19
申请人 CHEIL INDUSTRIES INC. 发明人 KIM SUNG-JUN;HONG CHANG-MIN
分类号 H01B1/20 主分类号 H01B1/20
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