| 摘要 |
A handling tool for electronic components includes a holding opening, to which a vacuum pressure may be applied and at which components to be handled are able to be held via vacuum pressure. At least one counter support, which outwardly projects beyond the opening plane in an operating position, is situated inside the holding opening. The component held by vacuum pressure is supported in the region of its surface acted upon by vacuum pressure, in such a way that this same surface bends concavely when viewed from the side of the vacuum pressure.
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