DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE BOARD, SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE MODULE

摘要

A device mounting board is provided with: an insulating resin layer; a wiring layer provided on one major surface of the insulating resin layer; and a bump electrode electrically connected to the wiring layer and configured to be projected from the wiring layer toward the insulating resin layer. The bump electrode has an approximately convex-shaped top surface and at least the peripheral area on the top surface thereof is curve-shaped.