摘要 |
<p>The method comprises generating plasmas with positively charged ions (21, 21'), which are to be accelerated on the substrates (4) by a negative bias potential, and reducing and/or compensating the positive loading of the substrate, which is caused by bombarding with the positively charged ions, by irradiating the substrate with electrons. The plasma is generated by cathode sputtering. First electrodes (7) are designed as an electron source and are used for irradiating the substrate with electrons and second electrodes are used for generating the bias potential. The method comprises generating plasmas with positively charged ions (21, 21'), which are to be accelerated on the substrates (4) by a negative bias potential, and reducing and/or compensating the positive loading of the substrate, which is caused by bombarding with the positively charged ions, by irradiating the substrate with electrons. The plasma is generated by cathode sputtering. First electrodes (7) are designed as an electron source and are used for irradiating the substrate with electrons, and second electrodes are used for generating the bias potential, where a negative voltage of -500 to -3000 V that is related to the mass potential is applied on each of the first and second electrodes independent of each other. The first electrodes are irradiated with laser light, so that they emit electrons for the irradiation of the substrate. The first electrodes are heated by an electric heater. The substrate is kept on an electrically insulated substrate holder (5). The plasma is generated by unbalanced magnetron-sputtering or high power impulse magnetron sputtering. An independent claim is included for a device for coating substrates.</p> |