发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To mount a light emitting diode package to an application without deforming a lead pattern of the light emitting diode package when connecting the light emitting diode package to the application different in the number of leads. <P>SOLUTION: This invention relates to a light emitting diode. This light emitting diode package includes: a body part for housing a light emitting diode therein; a lead electrically connected to the light emitting diode; and an adapter for housing and fixing the body part therein and housing a modified electrode electrically connected to the lead so that the polarity of the modified electrode is changed into the polarity of the lead. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010130005(A) 申请公布日期 2010.06.10
申请号 JP20090236690 申请日期 2009.10.13
申请人 SAMSUNG LED CO LTD 发明人 KIM TAE JUN;HAN YOUNG SUK;JUNG WON HO
分类号 H01L33/62 主分类号 H01L33/62
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