| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a side view type LED package structure having superior heat conduction effect, and to provide a manufacturing method and an application thereof. <P>SOLUTION: The side view type LED package structure 200 includes a silicon base 202, a first and a second conductive leads and at least a first LED chip 212. The silicon base 202 includes a first cavity 208 defining a light-extracting surface 224. The first and the second conductive leads are respectively disposed at least on a portion and another portion of the first cavity 208 and extend to an outer surface of the silicon base 202. The first and the second conductive leads are electrically isolated from each other. The LED chip 212 includes a first and second electrodes electrically connected to the first and the second conductive leads respectively, wherein the surface on the outer side of the silicon base 202 is substantially perpendicular to the light-extracting surface 224. <P>COPYRIGHT: (C)2010,JPO&INPIT |
