| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for accurately cutting a substrate without damaging a protection target member, regardless of the thickness of the substrate. <P>SOLUTION: A laser beam D is applied to planned cutting lines C<SB>CF</SB>and C<SB>TFT</SB>of substrate materials 110 and 120 so as to form reformed regions 160, and the parts at which the reformed regions 160 are formed are etched so as to form grooves. Since this enables reduction of energy of the laser beam D applied to the substrate materials 110 and 120, damages of various parts such as an external terminal 23 positioned between the substrate materials 110 and 120 caused by the laser beam D penetrating the CF substrate material 110 can be prevented when applying the laser beam D to form the reformed regions 160 on the substrate materials 110 and 120. Thus, when manufacturing a liquid crystal panel, a laminated material 12 can be accurately cut without damaging the external terminal 23 etc., even when manufacturing a thin liquid crystal panel. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
