| 摘要 |
PROBLEM TO BE SOLVED: To provide a glass circuit board that achieves a high adhesion between a glass substrate and an electrode or wiring, the electrode or wiring being formed by depositing conductive metal particles into the through-holes or recesses of the glass substrate by a cold spray process, and to provide a method of manufacturing the same. SOLUTION: In the recesses 13 of a glass substrate 11, an intermediate layer 14 is formed of, for example, titanium materials such as pure Ti, TiN, TiC, TiCN, and TiAlN. The titanium materials have a higher hardness or a higher coefficient of elasticity than the glass substrate 11. Further, the metal wiring 16 is formed by depositing conductive metal particles by the cold spray process. The energy in collision of the conductive metal particles with the intermediate layer 14 is effectively used for the plastic deformation of the conductive metal particles, thereby it is possible to achieve sufficient plastic deformation on the conductive metal particles and improve the adhesion of the metal wiring 16 with the glass substrate 11. COPYRIGHT: (C)2010,JPO&INPIT
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