| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical sensor module easy to assemble even if the module has a structure to essentially have an opening and to cover it. SOLUTION: An opening 101 having a predetermined area is formed in a casing 100. A cover member 40 is provided in the opening 101. In the cover member 40, a flat plate member 41 facing the opening 101, and an elastic support member 42 for supporting the flat plate member 41 relative to a circuit board 20, are fixed to each other. A UV sensor element 10 is mounted on the cover member 40 side of the circuit board 20. Here, the support member 42 and the circuit board 20 are fixed, and thereby, a UV sensor module 1 including the cover member 40, the UV sensor element 10 and the circuit board 20 is formed. With this structure, a package type UV sensor module 1P is assembled only by providing the UV sensor module 1 in the casing 100 such that the flat plate member 41 faces the opening 101 of the casing 100. COPYRIGHT: (C)2010,JPO&INPIT
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