| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for dividing a substrate and a method of dividing the substrate by which the substrate is divided by applying load uniformly on the substrate. Ž<P>SOLUTION: The apparatus 21 for dividing the substrate W is provided with a pair of supporting members 22 for supporting the substrate W at a line-symmetric position centered around an opposed half-scribing line 15 from the back surface side on which the opposed half-scribing line 15 is formed and a break bar 23 for dividing the substrate W by pressing the substrate W from the surface side right above the opposed half-scribing line 15 in parallel to the opposed half-scribing line 15. A break bar body 41 of the break bar 23 pressing the substrate W is formed in a straight shape to be shorter than the width of the substrate W so as not to cause the bending of the substrate in the width direction on pressing. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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