| 摘要 |
A liquid treatment device having a substrate holding section (2) for horizontally holding a wafer (W) and capable of rotating with the wafer (W), a rotation cup (4) having an annular shape so as to surround the wafer (W) held by the substrate holding section (2) and capable of rotating with the wafer (W), a rotation mechanism (3) for integrally rotating the rotation cup (4) and the substrate holding section (2), a nozzle (5) for supplying a treatment liquid for the wafer (W) and a cleaning liquid for the rotation cup (4), a liquid supply section (85) for supplying the treatment liquid and cleaning liquid to the nozzle (5), and a nozzle movement mechanism for moving the nozzle (5) between a first position at which the liquid is discharged to the wafer (W) and a second position at which the liquid is discharged to an external portion of the rotation cup (4). The wafer (W) is treated with the liquid with the nozzle (5) positioned at the wafer treatment position, and the cleaning liquid is discharged to the external portion of the rotation cup with the nozzle (5) positioned at the rotation cup cleaning position.
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