发明名称 |
SEMICONDUCTOR CHIP BUMP CONNECTION APPARATUS AND METHOD |
摘要 |
Various semiconductor chip packages and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a solder bump to a side of a semiconductor chip and bringing the solder bump into contact with a conductor pad coupled to a substrate and positioned in an opening of a solder mask on the substrate. The conductor pad has a first lateral dimension and the opening has a second lateral dimension that is larger than the first lateral dimension. A metallurgical bond is established between the solder bump and the conductor pad.
|
申请公布号 |
US2010140798(A1) |
申请公布日期 |
2010.06.10 |
申请号 |
US20100692239 |
申请日期 |
2010.01.22 |
申请人 |
TOPACIO RODEN R;CHAN VINCENT;YEUNG FAN |
发明人 |
TOPACIO RODEN R.;CHAN VINCENT;YEUNG FAN |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|