ALTERNATING CURRENT LIGHT EMITTING DIODE CHIP AND ITS PROCESSING METHOD

摘要

PURPOSE: An alternating current light emitting diode chip and a method for manufacturing the same are provided to effectively emit heat from a light emitting diode by filling metal with superior conductivity to the via hole of a substrate. CONSTITUTION: A buffer layer(102), a first semiconductor layer(104), an active layer(106) and a second semiconductor layer(108) are formed on the upper side of a first substrate. A reflective film is formed on a part of the second semiconductor layer. A part of the first semiconductor layer is exposed through the second semiconductor layer excluding the reflective film by mesa-etching. An insulator(114) is deposited on the second semiconductor layer excluding the reflective film. A first electrode is deposited on the part of the first semiconductor layer on which the insulator is not deposited. Bonding metal is deposited on the reflective film and the upper part of the first electrode.