| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power semiconductor that is improved in productivity and reduced in cost. <P>SOLUTION: The power semiconductor device includes: a plurality of power semiconductor units 1a and 1b each sealed with a transfer mold resin 11 such that an insertion hole 3a of a conductive cylindrical terminal 3 into which an external terminal 2 can be inserted to be connected is exposed on one surface and a metal heat dissipating surface 4a is exposed on the other surface; and a conductive coupling member 5 having a plurality of external terminals 2. Surfaces of the plurality of power semiconductor units 1a and 1b which have insertion holes 3a of cylindrical terminals 3 are arrayed facing to the same direction, and the external terminals 2 of the conductive coupling member 5 are inserted into the insertion holes 3a of the cylindrical terminals 3 of the plurality of power semiconductor units 1a and 1b, which are electrically connected to each other. <P>COPYRIGHT: (C)2010,JPO&INPIT |
