| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate support unit for supporting semiconductor substrates in a single wafer processing system, and to provide a substrate polishing apparatus using the substrate support unit to polish and clean substrates. <P>SOLUTION: A lower surface of the substrate is subjected to vacuum suction when the substrate support unit is in a polishing process. The substrate is supported while being separated upward to clean a lower surface of the substrate in a process after cleaning, thus providing the substrate support unit capable of sequentially proceeding with the polishing process to an upper surface of the substrate while the substrate is being supported by the substrate support unit in a single wafer processing system and the process after cleaning to upper and lower surfaces of the substrate following the polishing process, and providing the apparatus and method for polishing substrates by using the substrate support unit. <P>COPYRIGHT: (C)2010,JPO&INPIT |
