| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a holding pad the whole surface of which can be attached to a polishing device while securing the flatness of a surface even if enlarged in size. <P>SOLUTION: The holding pad 20 includes a urethane sheet 12 having a holding surface S, an adhesive sheet 14, a resin sheet 16 having elasticity, and an adhesive sheet 15. In the adhesive sheet 14, adhesive layers 45, 46 are disposed to be adjacent to each other in a boundary D1, and in the adhesive sheet 15, adhesive layers 55, 56 are disposed to be adjacent to each other in a boundary D2. The other side of the adhesive sheet 14 is stuck to one side of the resin sheet 16, and the one side of the adhesive sheet 15 is stuck to the other side of the resin sheet. A side of the urethane sheet 12 opposite to the holding surface S is stuck to one side of the adhesive sheet 14. The boundary D1 is formed in a position at one side of a central part of the holding pad 20 in a width direction, and the boundary D2 is formed in a position in the other side. Steps in the boundaries D1, D2 are absorbed by the resin sheet 16. <P>COPYRIGHT: (C)2010,JPO&INPIT |
