发明名称 |
CERAMIC PACKAGE FOR HEADLAMP AND HEADLAMP MODULE EQUIPPED WITH THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ceramic package for a headlamp, the package being simple in structure and maximizing the efficiency of light by increasing the heat radiation characteristic so as to smoothly radiate heat from the ceramic package joined onto a substrate, and to provide a headlamp module equipped with the same. <P>SOLUTION: The ceramic package with a light-emitting diode includes: a body part with a cavity opened toward its upper part side such that the light-emitting diode mounted on a mounting part is exposed through the cavity; an inner electrode electrically coupled with the light-emitting diode in the body part; and an electrode exposing part formed such that both side faces of the body part are stepped so as to expose the inner electrode upward to the outside from within the body part. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010129539(A) |
申请公布日期 |
2010.06.10 |
申请号 |
JP20080334725 |
申请日期 |
2008.12.26 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
LEE YOUNG JIN;KIM HYUNG KUN |
分类号 |
F21S8/10;F21W101/10;F21Y101/02 |
主分类号 |
F21S8/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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