| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multi-layer printed circuit board and a manufacturing method thereof, that can prevent curving occurring when a printed circuit board is manufactured. <P>SOLUTION: The manufacturing method includes te steps of: forming an outermost insulation layer, in which openings are formed corresponding to the external contact pads; forming a mask, in which openings are formed corresponding to the external contact pad and a circuit pattern, on the outermost insulation layer; forming the external contact pads and the circuit pattern in the openings of the outermost insulation layer and the openings of the mask; removing the mask; forming a build-up layer by stacking layers over the outermost insulation layer so that the external contact pads and the circuit pattern are covered; forming a first solder resist layer on the build-up layer; forming a second solder resist layer on an opposite side of the outermost insulation layer where the build-up layer is formed; and forming openings in the second solder resist layer so that the external contact pads are exposed. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
