| 摘要 |
<P>PROBLEM TO BE SOLVED: To stabilize the coating amount of solder on a substrate of a module structured having a metal cover attached onto the substrate. Ž<P>SOLUTION: On a side surface of a circuit board 12, a reception portion 16 for receiving a projection 14d of the metal cover 14 is provided, and a conductor pattern 18 is formed from a mounting surface of the circuit board 12 into the reception portion 16. Cream solder 20 is applied onto the mounting surface of the circuit board 12 in the manufacturing stage so as to solder the projection 14d in the reception portion 16, but an opening 26a is bored in the solder resist 26 in a coating area 18b thereof and a conductive pattern is expanded inside the mounting surface from the vicinity of the reception portion 16 within a range thereof. Consequently, the cream solder 20 can be applied directly onto the conductive pattern 18, and the amount of application by a dispense nozzle etc., can be stabilized. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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