| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board and its manufacturing method using a common wiring material which have different thicknesses, and a simple transfer technology, in particular, which is most suitable for preparing conductor layers on the same substrate which are most suited for a signal and power. Ž<P>SOLUTION: The circuit board has an insulating resinous substrate 1 having a first main surface 1a and a second main surface 1b, and first and second conductor layers 2 and 3 that are buried in the first main surface side 1a of the insulating resinous substrate 1 and have different thicknesses wherein the first and second conductor layers 2 and 3 are patterned so that they are juxtaposed in a direction along the first main surface 1a, and buried so that respective outer surfaces located in the first main surface side 1a may be on the same plane. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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