| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an addition agent for an electroless copper-plating solution, which does not obstruct the deposition in a plating process, shows an adequate appearance of a plated film, and can impart adequate stability with time to the electroless copper-plating solution. Ž<P>SOLUTION: The addition agent for the electroless copper-plating solution employs a compound having two or more of unit structures expressed by the general formula (1) in the molecule, wherein R represents a hydrogen atom or an aliphatic group; and Y represents an aliphatic group having an acidic group of less than 6 by pKa as a substituent. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
