CONDITIONER FOR SEMICONDUCTOR POLISHING CLOTH AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a conditioner for semiconductor polishing cloth for improving grinding efficiency of cutting edges and for stably securing a tool life for a long period of time, and to provide a method of manufacturing the conditioner.

SOLUTION: The conditioner for the semiconductor polishing cloth grinds the semiconductor polishing cloth arranged to face against a substrate 11 by using the plurality of cutting edges formed on the substrate 11. A plurality of seat parts 11A protruding toward a semiconductor polishing cloth side are formed in the substrate 11. The cutting edges include a first cutting edges 1 formed to protrude from surfaces of the seat parts 11A and second cutting edges 2 formed to protrude from the surface of the substrate 11. The surface of the substrate 11, the surfaces of the seat parts 11A and the first and second cutting edges 1, 2 are coated by diamond films. The height H2 of the second cutting edges 2 from the surface of the substrate 11 is set to be higher than the height H1 of the first cutting edges 1 from the surface of the substrate 11.

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